Hybrid source and drain contact formation using metal liner and metal insulator semiconductor contacts

ABSTRACT

An electrical device including a first semiconductor device having a silicon and germanium containing source and drain region, and a second semiconductor device having a silicon containing source and drain region. A first device contact to at least one of said silicon and germanium containing source and drain region of the first semiconductor device including a metal liner of an aluminum titanium and silicon alloy and a first tungsten fill. A second device contact is in contact with at least one of the silicon containing source and drain region of the second semiconductor device including a material stack of a titanium oxide layer and a titanium layer. The second device contact may further include a second tungsten fill.

BACKGROUND

Technical Field

The present disclosure relates to electrical devices, such assemiconductor devices. The present disclosure further relates toprocessing of materials suitable for the contacts to semiconductordevices.

Description of the Related Art

Semiconductor field effect transistors (FETs) continue to get smallerbecause of technological improvements in semiconductor fabricationprocesses. The technological improvements have enabled aggressivedown-scaling of FETs, and the aggressive down-scaling has resulted inincreased density of electrical components on integrated circuits.However, as FETs get smaller, challenges arise that can negativelyimpact their utility and performance. One challenge often encountered insemiconductor fabrication, which arises due to down-scaling of FETs, isthe ability to provide FETs with low source/drain (S/D) contactresistance. A contact is an interface material between a FET substrateand interconnect wiring, wherein the interconnect wiring is routed toconnect a FET to other integrated circuit components distributed on thesurface of the substrate. A source/drain contact can enhance electricalcurrent flow (i.e., reduce resistance) between substrate andinterconnect wiring. However, as surface area of contacts decrease, dueto the aggressive down-scaling, contact resistance can increase andcause a reduction of FET performance, such as a reduction in transistorswitching speed.

SUMMARY

In one embodiment, the present disclosure provides a method of formingcontacts to an electrical device including semiconductor devicescomposed of silicon and silicon germanium materials. In one embodiment,the method includes providing a first via to a first semiconductordevice comprising at least one of a silicon and germanium containingsource and drain region and providing a second via to a secondsemiconductor device comprising at least one of a silicon containingsource and drain region. A material stack is formed in the first andsecond via, the first material stack comprising a titanium layer and analuminum layer. Forming a mask protecting the first via. Converting thealuminum layer of the first material stack within the second vial toaluminum oxide. Removing the aluminum oxide with an etch that isselective to the titanium layer. Converting the titanium layer presentin the second via to titanium oxide with an oxidation anneal, whereinduring said oxidation anneal the aluminum layer in the first via alloyswith the titanium layer and silicon from the silicon containing sourceand drain region. A metal layer is deposited in the second via. Tungstenfills at least one of the first and second via.

In another embodiment, the method includes providing a first via to afirst semiconductor device comprising at least one of a silicon andgermanium containing source and drain region and providing a second viato a second semiconductor device comprising at least one of a siliconcontaining source and drain region. A material stack is formed in thefirst and second via, the first material stack comprising a titaniumlayer at a base of said first and second via, an aluminum layer on thetitanium layer, and a tungsten fill. The tungsten fill and the aluminumlayer is removed from the second via. The titanium layer present in thesecond via is converted to titanium oxide with an oxidation anneal,wherein during said oxidation anneal the aluminum layer in the first viaalloys with the titanium layer and silicon from the silicon containingsource and drain region. A titanium layer is deposited in the secondvia. Tungsten is deposited in the second via.

In another aspect, an electrical device is provided that includes afirst semiconductor device present in a first region of a substrate, thefirst semiconductor device including at least one of a silicon andgermanium containing source and drain region; and a second semiconductordevice in a second region of a substrate, the second semiconductordevice including at least one of a silicon containing source and drainregion. A first device contact to at least one of said silicon andgermanium containing source and drain region of the first semiconductordevice, the first device contact including a metal liner of an aluminumtitanium and silicon alloy at a base of the first device contact and afirst tungsten fill. A second device contact to at least one of thesilicon containing source and drain region of the second semiconductordevice, the second device contact comprising a material stack of atitanium oxide layer at the base of the second device contact and atitanium layer atop the titanium oxide layer. The second device contactmay further include a second tungsten fill.

BRIEF DESCRIPTION OF DRAWINGS

The following detailed description, given by way of example and notintended to limit the disclosure solely thereto, will best beappreciated in conjunction with the accompanying drawings, wherein likereference numerals denote like elements and parts, in which:

FIG. 1 is a side cross-sectional view depicting one embodiment of sourceand drain contacts to semiconductor devices, in accordance with presentdisclosure.

FIG. 2A is a side cross-sectional view of a first via opening to atleast one of a source region or drain region of a semiconductor devicecomposed of silicon and germanium, wherein the first via opening isfilled with a material stack comprising a titanium layer atop thesurface of the source or drain region, an aluminum layer atop thetitanium layer, and a tungsten fill, in accordance with one embodimentof the present disclosure.

FIG. 2B is a side cross-sectional view of a second via opening to atleast one of a source region or drain region a semiconductor device thatis composed of silicon, wherein the second via opening is filled with amaterial stack comprising a titanium layer atop the surface of thesource or drain region, an aluminum layer atop the titanium layer, and atungsten fill, in accordance with one embodiment of the presentdisclosure.

FIG. 3A is a side-cross sectional view depicting forming a block maskover the first via opening that is depicted in FIG. 2A.

FIG. 3B is a side-cross sectional view depicting removing the firsttungsten layer from the second contact via, while the block mask ispresent over the first contact via depicted in FIG. 3A.

FIG. 4A is a side-cross sectional view depicting stripping the blockmask from covering the first contact via after the tungsten fill hasbeen removed from the second contact via, in accordance with oneembodiment of the present disclosure.

FIG. 4B is a side-cross sectional view depicting one embodiment ofconverting the aluminum layer of the first material stack within thesecond via opening to aluminum oxide, in accordance with one embodimentof the present disclosure.

FIG. 5A is a side cross-sectional view depicting the first contact via,while the aluminum oxide layer in the second via opening is removedselectively to at least the titanium layer.

FIG. 5B is a side cross-sectional view depicting removing the aluminumoxide layer selectively to the titanium layer, in accordance with oneembodiment of the present disclosure.

FIG. 6A is a side cross-sectional view depicting alloying one embodimentof the aluminum from the aluminum layer and the titanium from thetitanium layer with silicon from the silicon and germanium includingsource and rain region in the first contact via, while the titaniumlayer in the second contact via is being converted to titanium oxidewith an oxidation anneal.

FIG. 6B is a side cross-sectional view depicting converting the titaniumlayer present in the second via to titanium oxide with an oxidationanneal, in accordance with one embodiment of the present disclosure.

FIG. 7A is a side cross-sectional view depicting the first contact via,while a metal layer is being deposited in the second via openingdirectly on the titanium oxide layer.

FIG. 7B is a side cross-sectional view of the second via openingdepicting one embodiment of forming a metal layer on a titanium oxidelayer, in accordance with the present disclosure.

FIG. 8A is a side cross-sectional view depicting depositing a metal fillatop the first via opening, in accordance with one embodiment of thepresent disclosure.

FIG. 8B is a side cross-sectional view depicting depositing a tungstenfill within the second via opening, in accordance with one embodiment ofthe present disclosure.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Detailed embodiments of the claimed structures and methods are disclosedherein; however, it is to be understood that the disclosed embodimentsare merely illustrative of the claimed structures and methods that maybe embodied in various forms. In addition, each of the examples given inconnection with the various embodiments is intended to be illustrative,and not restrictive. Further, the figures are not necessarily to scale,some features may be exaggerated to show details of particularcomponents. Therefore, specific structural and functional detailsdisclosed herein are not to be interpreted as limiting, but merely as arepresentative basis for teaching one skilled in the art to variouslyemploy the methods and structures of the present disclosure. Forpurposes of the description hereinafter, the terms “upper”, “lower”,“right”, “left”, “vertical”, “horizontal”, “top”, “bottom”, andderivatives thereof shall relate to the embodiments of the disclosure,as it is oriented in the drawing figures. The terms “positioned on”means that a first element, such as a first structure, is present on asecond element, such as a second structure, wherein interveningelements, such as an interface structure, e.g. interface layer, may bepresent between the first element and the second element. The term“direct contact” means that a first element, such as a first structure,and a second element, such as a second structure, are connected withoutany intermediary conducting, insulating or semiconductor layers at theinterface of the two elements.

In some embodiments, the methods and structures disclosed herein providefor low defect contacts to semiconductor devices, which also havesuitable contact resistivity. Nickel silicide contacts typically have alow contact resistivity, but is susceptible to nickel silicide (NiSi)“pipe” defect generation, which can be present under sidewalls of thegate structures of semiconductor devices, which can cause source anddrain region short that result in yield loss, e.g., static random accessmemory (SRAM) device yield loss. Titanium silicide contacts, unlikenickel silicide, do not generate defects, such as pipe defects, but thehigh contact resistivity of titanium silicide can reduce deviceperformance due to a higher contact resistance. In some examples,because titanium silicide (TiSi_(x)) is an n-type metal, this can be anissue for the source and contacts to p-type semiconductor devices.

In some embodiments, the methods and structures provided herein providea metal-insulator-semiconductor (MIS) contact in which Fermi levelpinning is released, and the effective Schottky barrier height isreduced. This is one of methods to reduce contact resistivity forsemiconductor devices. Titanium oxide (TiO₂) is one example of aninsulating material suitable for metal insulator semiconductor (MIS)contact, in accordance with the methods and structures disclosed herein.In some embodiments, because the conduction band off-set betweentitanium oxide (TiO₂) and semiconductors, such as silicon (Si) andgermanium (Ge), is small, a wide process margin is provided by themethods disclosed herein to optimize contact resistivity, especiallywith respect to insulator thickness. In some embodiments, the methodsand structures disclosed herein can provide a hybrid contact linerscheme. For example, a metal silicide comprising an Al—Ti—Si alloy on asilicon and germanium containing, e.g., silicon germanium (SiGe),contact surface may provide the electrical contact to the source anddrain regions of a p-type field effect transistor (PFET); and theelectrical contact to the silicon containing, e.g., silicon (Si),contact surface of the source and drain regions of an n-type fieldeffect transistor (NFET) may be provided by a titanium oxide (TiO₂) andtitanium layered material stack. As will be described in further detailbelow, some steps for implementing the aforementioned hybrid contactliner scheme include forming the material layers for providing analuminum titanium and silicon (Al—Ti—Si) alloy metal in first viaopenings to the p-type semiconductor devices, and then removing and/ormodifying the same material layers in second via openings to form thetitanium oxide and titanium material layer stack in the second viaopening to the source and drain regions of the n-type semiconductordevices. For example, the aluminum layer in the second via opening isconverted to aluminum oxide to etch the oxide from the titaniumselectively, which minimizes trench widening. Thereafter, in someembodiments, the titanium layer is treated with an oxygen containingplasma to form titanium oxide, and a titanium layer can be depositedatop the titanium oxide layer to provide the titanium oxide (TiO₂) andtitanium layered material stack within the second via opening to then-type field effect transistor (NFET). The methods and structures of thepresent disclosure are now described with greater detail referring toFIGS. 1-8B.

FIG. 1 depicts one embodiment of an electrical device 100 includingsemiconductor devices 50 a, 50 b having contacts formed using a hybridcontact liner scheme that includes a metal insulator semiconductor (MIS)contact. As used herein, the term “semiconductor device” refers to anintrinsic semiconductor material that has been doped, that is, intowhich a doping agent has been introduced, giving it different electricalproperties than the intrinsic semiconductor. Doping involves addingdopant atoms to an intrinsic semiconductor, which changes the electronand hole carrier concentrations of the intrinsic semiconductor atthermal equilibrium. Dominant carrier concentration in an extrinsicsemiconductor determines the conductivity type of the semiconductor. Afield effect transistor (FET) is a semiconductor device in which outputcurrent, i.e., source-drain current, is controlled by the voltageapplied to a gate structure to the semiconductor device. A field effecttransistor has three terminals, i.e., gate structure, source region anddrain region. In some examples, the field effect transistor may be aplanar device. In a planar device the gate structure is formed atop anupper surface of the substrate that provides the channel region of thedevice, in which source and drain regions are present on the substrateon opposing sides of the channel region. FIG. 1 depicts one embodimentof the present disclosure that employs planar semiconductor devices,i.e., planar field effect transistors, e.g., an p-type field effecttransistor 50 a and an n-type field effect transistor 50 b. In otherembodiments, the semiconductor device may be a FinFET semiconductordevice. In a FinFET semiconductor device the channel region of thesemiconductor device is present in a fin structure. As used herein, a“fin structure” refers to a semiconductor material, which is employed asthe body of a semiconductor device, in which the gate structure ispositioned around the fin structure such that charge flows down thechannel on the two sidewalls of the fin structure and optionally alongthe top surface of the fin structure. Any semiconductor device mayprovide the contact surface that the contacts are formed to. Forexample, the semiconductor device may be a planar FET or may be abipolar junction transistor. In other examples, it is not necessary thatthe contacts disclosed herein are formed to semiconductor devices, asany electrical device is suitable for use with the methods andstructures disclosed herein, such as memory devices, e.g., RAM, MRAM andflash memory, and passive devices, e.g., resistors and capacitors.

Referring to FIG. 1, in one embodiment, the electrical device 100 mayinclude a first semiconductor device 50 a present in a first region of asubstrate 1, and a second semiconductor device 50 b that is present in asecond region of the substrate 1. The first semiconductor device 50 aincludes at least one of a silicon and germanium containing sourceregion 20 a, and a silicon and germanium containing drain region 20 b.The second semiconductor device 50 b includes at least one of a siliconcontaining source region 25 a and a silicon containing drain region 25b. As used herein, the term “drain” means a doped region insemiconductor device located at the end of the channel region, in whichcarriers are flowing out of the transistor through the drain. The term“source” is a doped region in the semiconductor device, in whichmajority carriers are flowing into the channel region.

The silicon and germanium containing source and drain regions 20 a, 20 bfor the first semiconductor device 50 a can be composed of silicongermanium (SiGe). But, the silicon and germanium containing source anddrain regions 20 a, 20 b are not limited to only silicon germanium(SiGe). In some embodiments, the germanium content of the silicon andgermanium containing source and drain regions 20 a, 20 b may range from5% to 70%, by atomic weight %. In some embodiments, the germanium (Ge)content of the silicon and germanium containing source and drain regions20 a, 20 b may be greater than 20 at. %. In other embodiments, thegermanium (Ge) content of the silicon and germanium containing sourceand drain regions 20 a, 20 b ranges from 20 at. % to 100 at. %. Inanother embodiment, the germanium content of the silicon and germaniumcontaining source and drain regions 20 a, 20 b may range from 10% to40%. Examples of materials suitable for the silicon and germaniumcontaining source and drain regions 20 a, 20 b include silicon germanium(SiGe), silicon germanium doped with carbon (SiGe:C), hydrogenatedsilicon germanium and combinations thereof.

The silicon containing source and drain regions 25 a, 25 b of the secondsemiconductor device 50 b are typically germanium free. As used herein,the term “silicon containing” in combination with “germanium free”, asused to describe a semiconductor material, means a material layer ofsilicon that is substantially free of germanium. In some embodiments, bybeing substantially free of germanium, it is meant that the germaniumcontent is less than 5 at. %. For example, the germanium content may beless than 1 at. %, and in some examples, the silicon includingsemiconductor substrate and/or silicon including fin structures 5 may beentirely free of germanium (Ge). In some embodiments, the siliconincluding material that provides the source and drain regions 25 a, 25 bof the second semiconductor device 50 b may include, but is not limitedto, silicon, single crystal silicon, multicrystalline silicon,polycrystalline silicon, amorphous silicon, strained silicon, silicondoped with carbon (Si:C), silicon alloys or any combination thereof. Inone example, the source and drain regions 25 a, 25 b of the secondsemiconductor device 50 b are composed of greater than 99 at. % silicon(Si), e.g, 100 at. % silicon (Si).

The source and drain regions 20 a, 20 b, 25 a, 25 b are typically dopedto a conductivity type that provides the conductivity type of thesemiconductor device 50 a, 50 b. For example, the source region 20 a anddrain region 20 b of the first semiconductor device 50 a may be dopedp-type to provide an p-type field effect transistor (FET), and thesource region 25 a and drain region 25 b of the second semiconductordevice 50 b may be doped n-type to provide an n-type field effecttransistor (FET). As used herein, “p-type” refers to the addition ofimpurities to an intrinsic semiconductor that creates deficiencies ofvalence electrons. In a type IV semiconductor, such as silicon and/orgermanium, examples of p-type dopants, i.e., impurities, include but arenot limited to, boron, aluminum, gallium and indium. As used herein,“n-type” refers to the addition of impurities that contributes freeelectrons to an intrinsic semiconductor. In a type IV semiconductor,such as silicon and germanium, examples of n-type dopants, i.e.,impurities, include but are not limited to antimony, arsenic andphosphorous. The dopant for the epitaxial semiconductor material thatdictates the conductivity type of the source and drain regions 20 a, 20b is typically present in a concentration ranging from 1E17 atoms/cm³ to5E21 atoms/cm³.

In the embodiment that is depicted in FIG. 1, the source and drainregions 20 a, 20 b, 25 a, 25 b are raised source and drain regionscomposed of an epitaxial semiconductor material that is formed on anupper surface of the semiconductor substrate 1 on opposing sides of thegate structure 15 that is present on the channel region of the device.In this example, the source and drain regions may further includeextension regions 20 a′, 20 b′, 25 a′, 25 b′ that extend into thesemiconductor substrate 1 having a same conductivity type dopant as theraised source and drain regions 20 a, 20 b, 25 a, 25 b.

In one example, the source and drain regions 20 a, 20 b of the firstsemiconductor device 50 a are composed of silicon germanium (SiGe) thatis doped with boron (B) at a concentration of 5×10²° dopants/cm³, andthe source and drain regions 25 a, 25 b of the second semiconductordevice 50 b are composed of silicon (Si) that is doped with phosphorus(P) at a concentration of 5×10²⁰ dopants/cm³.

Each of the semiconductor devices 50 a, 50 b may include a gatestructure 15 including a gate dielectric 12 and a gate conductor 13 thatis composed of poly-silicon and/or metal layer. The gate dielectriclayer 12 can comprise an oxide, such as silicon dioxide, hafnium oxide,zirconium oxide, or a combination thereof, such as hafnium oxidedisposed on silicon dioxide. The gate conductor 13 can comprise a metallayer that can include, but is not limited to, aluminum (Al), hafnium(Hf), lanthanum (La), tantalum (Ta), titanium (Ti), or zirconium (Zr). Agate dielectric spacer 14 may be present on the sidewalls of the gatestructure 15. The gate dielectric spacer 14 can comprise nitride, oxide,or any other dielectric material. In some embodiments, the gatestructure can include a work function metal 12 a. The work functionmetal may include a TiN/TiC/TiN multilayer.

Still referring to FIG. 1, an interlevel dielectric layer 16 may bepresent on the first and second semiconductor devices 50 a, 50 bincluding a first via opening 28 for housing the first device contact 30to at least one of said silicon and germanium containing source anddrain region 20 a, 20 b of the first semiconductor device 50 a, and asecond via opening 29 for housing the second device contact 35 to atleast one of said silicon containing source and drain region 25 a, 25 bof the second semiconductor device 50 b. The interlevel dielectric layer15 may be selected from the group consisting of silicon containingmaterials such as SiO₂, Si₃N₄, SiO_(x)N_(y), SiC, SiCO, SiCOH, SiBCN andSiCH compounds, carbon doped oxides, inorganic oxides, inorganicpolymers, organic polymers such as polyamides or SiLK™, other carboncontaining materials, organo-inorganic materials such as spin-on glassesand silsesquioxane-based materials, and diamond-like carbon (DLC), aswell as combinations thereof.

The first device contact 30 to at least one of the silicon and germaniumcontaining source and drain region 20 a, 20 b of the first semiconductordevice 50 a may a metal liner 31 of an aluminum, titanium and siliconalloy at a base of the first device contact 20 and a first metal fill,such as a tungsten (W) fill. In one embodiment, the aluminum content ofthe aluminum, titanium and silicon alloy that provides the metal liner31 may range from 30 wt. % to 70 wt %. In one embodiment, the titaniumcontent of the aluminum, titanium and silicon alloy that provides themetal liner 31 may range from 30 wt. % to 70 wt. %. In one embodiment,the silicon content of the aluminum, titanium and silicon alloy thatprovides the metal liner 31 may range from 5 wt. % to 10 wt. %. Themetal liner 31 is typically a conformal layer that is present onsidewalls of the first via opening 28 and the base of the first viaopening 21 directly on a surface of the silicon and germanium source ordrain region 20 a, 20 b. The term “conformal” denotes a layer having athickness that does not deviate from greater than or less than 30% of anaverage value for the thickness of the layer. The metal liner 31 of thealuminum, titanium and silicon alloy typically has a thickness rangingfrom 1 nm to 10 nm. In one embodiment, the metal liner 31 of thealuminum, titanium and silicon alloy has a thickness ranging from 2 nmto 5 nm. In one example, the metal liner 31 of the aluminum, titaniumand silicon alloy has a thickness of 3 nm.

A metal fill 32 is present on, e.g., in direct contact, with the metalliner 21 of the aluminum, titanium and silicon alloy, and typicallyfills the first via opening 28. In one example, the metal fill 32 iscomposed of tungsten (W). It is noted that tungsten (W) is only oneexample of an electrically conductive material that is suitable for themetal fill 32. In other embodiments, the metal fill 32 may be composedof copper (Cu), aluminum (Al), platinum (Pt), titanium (Ti), silver(Ag), gold (Au) or an alloy or multi-layered combination of theaforementioned electrically conductive metals.

In one embodiment, the first device contact 30 is composed of a metalliner 31 of an aluminum, titanium and silicon alloy and a tungsten fill32 that completely fills the first via opening 28, in which the metalliner 31 is in direct contact with a boron doped p-type silicongermanium source/drain region.

The second device contact 35 to at least one of the silicon containingsource and drain region 25 a, 25 b of the second semiconductor device 50b may include a material stack of a titanium oxide layer 34 at the baseof the second device contact 35 and a metal layer 36 atop the titaniumoxide layer 34, wherein the second device contact 35 may further includea metal fill 33. In one embodiment, the titanium oxide layer 34 ispresent on the sidewalls of the second via opening 29 and the base ofthe second via opening 20, wherein the titanium oxide layer 34 may be indirect contact with a surface of the silicon containing source and drainregion 25 a, 25 b is typically composed of a material that has beenformed by treating a deposited titanium metal layer to an oxygencontaining plasma. The titanium oxide layer 34 is typically a conformallayer. The titanium oxide layer 34 can be a continuous layer within thesecond via opening 29. In one embodiment, the titanium oxide layer 34has a thickness ranging from 1 nm to 10 nm. In one embodiment, thetitanium oxide layer 34 has a thickness ranging from 2 nm to 5 nm. Inone example, the titanium oxide layer 34 has a thickness of 3 nm.

The metal layer 36 of the second device contact 35 may be in directcontact with the titanium oxide layer 34. In some embodiments, the metallayer 36 may be a conformal material layer. In some embodiments, themetal layer 36 in present over the sidewalls of the second via opening29 directly on the portion of the titanium oxide layer 34 that ispresent on the sidewalls of the second via opening 29, and the metallayer 36 is present directly on the titanium oxide layer 34 at the baseof the second via opening 29. The metal layer 36 may be a continuouslayer. In one embodiment, the metal layer 36 is composed of titanium(Ti). The metal layer 36 may be composed substantially entirely oftitanium. For example, the metal layer 36 may be greater than 95 wt. %titanium (Ti). In other embodiments, the metal layer 36 may be equal to99 wt. % titanium (Ti), and the metal layer 36 can be 100 wt. %titanium. It is noted that the above titanium compositions for the metallayer 36 are provided for illustrative purposes, and are not intended tolimit the present disclosure. For example, in some other embodiments,the metal layer 36 may be composed of aluminum (Al), titanium (Ti),copper (Cu), tungsten (W), gold (Au), silver (Ag), or an alloy thereof,or a multilayer combination thereof. The metal layer 36 can have athickness ranging from 1 nm to 10 nm. In one embodiment, the metal layer36 has a thickness ranging from 2 nm to 5 nm. In one example, the metallayer 36 has a thickness of 3 nm.

A metal fill 33 may be present on, e.g., in direct contact, with themetal layer 36, and typically fills the second via opening 29 containingthe second device contact 35. In one example, the metal fill 33 iscomposed of tungsten (W). It is noted that tungsten (W) is only oneexample of an electrically conductive material that is suitable for themetal fill 33. In other embodiments, the metal fill 33 may be composedof copper (Cu), aluminum (Al), platinum (Pt), titanium (Ti), silver(Ag), gold (Au) or an alloy or multi-layered combination of theaforementioned electrically conductive metals.

In one embodiment, the second device contact 35 is composed of atitanium oxide layer 34, a titanium metal layer 36, and a tungsten fill33 that completely fills the second via opening 29, in which thetitanium oxide layer 34 is in direct contact with a phosphorus dopedn-type silicon source/drain region.

Further details regarding the structure depicted in FIG. 1 may now bedescribed detail with reference to FIGS. 2A-8B, which describe at leastsome steps for implementing one embodiment of the hybrid contact linerscheme for forming the first and second device contacts 30, 35 depictedin FIG. 1. For the purposes of simplicity FIGS. 2A-8B illustrate onlythe first and second via openings 28, 29 of the structure depicted inFIG. 1, as well as some steps for forming the first and second devicecontacts 30, 35. Although the first and second via openings are depictedin separate views throughout FIGS. 2A-8B, the depicted method steps areto be implemented in via openings to devices on the same substratesubstantially simultaneously. FIGS. 2A-2B also illustrate the processsteps for forming the contact to the source regions 20 a, 25 a of thefirst and second semiconductor device 50 a, 50 b. The illustrations (andrelated descriptions) provided for forming the contacts to the sourceregions 20 a, 25 a are equally suitable for forming the contacts to thedrain regions 20 a, 25 a.

FIG. 2A depicts a first contact via 28 to at least one of a sourceregion 20 a of a semiconductor device 50 a composed of silicon andgermanium, e.g., silicon germanium (SiGe), wherein the first contact via28 is filled with a material stack comprising a titanium layer 51 atopthe surface of the source region 20 a, an aluminum layer 52 atop thetitanium layer 51, and a tungsten fill 32. FIG. 2B depicts a secondcontact via 29 to at least one of a source region 25 a of asemiconductor device 50 b that is composed of silicon, wherein thesecond contact via 29 is filled with a material stack comprising atitanium layer 51 atop the surface of the source region 35 a, analuminum layer 52 atop the titanium layer 51, and a tungsten fill 32. Insome embodiments, at this stage of the present disclosure the titaniumlayer 51, the aluminum layer 52 and the tungsten fill 32 that is presentin the first contact via 28 is the same as the titanium layer 51, thealuminum layer 52 and the tungsten fill 32 that is present in the secondcontact via 29. The source regions 20 a, 25 a including the compositionand conductivity type have been described above in the description ofthe first and second semiconductor devices 50 a, 50 b that are depictedin FIG. 1. Further, the interlevel dielectric 16, as well as the firstand second via opening 28, 29, that are depicted in FIGS. 2A and 2B havebeen described above in the description of the first and secondsemiconductor devices 50 a, 50 b that are depicted in FIG. 1.

Referring to FIGS. 2A and 2B, the titanium layer 51 may be composedsubstantially entirely of titanium. For example, the titanium layer 51may be greater than 95 wt. % titanium (Ti). In other embodiments, thetitanium layer 51 may be equal to 99 wt. % titanium (Ti) or greater,e.g., the titanium layer 51 can be 100 wt. % titanium. The titaniumlayer 51 may be a continuous layer that is formed on the sidewalls andbase of the first and second via openings 28, 29. For example, thetitanium layer 51 may be formed direct on a surface of the source anddrain regions 20 a, 20 b, 25 a, 25 b of the semiconductor devices 50 a,50 b at the base of the first and second via openings 28, 29. Thetitanium layer 51 may also extend from the first and second via openings28, 29 atop an upper surface of the interlevel dielectric 16. In someembodiments, the titanium layer 51 may be a single material layer thatis present in each of the first and second via openings 28, 29 andextends across the upper surfaces of the interlevel dielectric 16between the adjacent first and second via openings 28, 29 to each of thefirst and second semiconductor devices 50 a, 50 b in a continuousfashion. The titanium layer 51 may be a conformally deposited layerhaving a thickness ranging from 1 nm to 10 nm. In some embodiments, thetitanium layer 51 has a thickness ranging from 2 nm to 5 nm. In oneexample, the titanium layer 51 has a thickness of 3 nm. The titaniumlayer 51 may be deposited using a deposition method, such as physicalvapor deposition (PVD), chemical vapor deposition (CVD) or atomic layerdeposition. (ALD). Examples of PVD suitable for forming the titaniumlayer 51 include plating, electroplating, electroless plating,sputtering and combinations thereof. Examples of sputtering apparatusthat may be suitable for depositing the titanium layer 51 include DCdiode type systems, radio frequency (RF) sputtering, magnetronsputtering and ionized metal plasma (IMP) sputtering.

The aluminum layer 52 may be composed substantially entirely ofaluminum. For example, the aluminum layer 52 may be greater than 95 wt.% titanium (Ti). In other embodiments, the aluminum layer 52 may beequal to 99 wt. % titanium (Ti) or greater, e.g., the aluminum layer 52can be 100 wt. % aluminum. The aluminum layer 52 may be a continuouslayer that is formed directly on the titanium layer 51 that is presenton the sidewalls and base of the first and second via openings 28, 29.For example, the aluminum layer 52 may be formed directly on thetitanium layer 51 that is present on a surface of the source and drainregions 20 a, 20 b, 25 a, 25 b of the semiconductor devices 50 a, 50 bat the base of the first and second via openings 28, 29. Similar to thetitanium layer 51, the aluminum layer 52 may also extend from the firstand second via openings 28, 29 atop an upper surface of the interleveldielectric 16, e.g., the aluminum layer 52 being directly on thetitanium layer 51 that is present on the upper surfaces of theinterlevel dielectric 16. In some embodiments, the aluminum layer 52 maybe a single material layer that is present in each of the first andsecond via openings 28, 29 and extends across the upper surfaces of theinterlevel dielectric 16 between the adjacent first and second viaopenings 28, 29 to each of the first and second semiconductor devices 50a, 50 b in a continuous fashion. The aluminum layer 52 may be aconformally deposited layer having a thickness ranging from 1 nm to 10nm. In some embodiments, the aluminum layer 52 has a thickness rangingfrom 2 nm to 5 nm. In one example, the aluminum layer 52 has a thicknessof 3 nm. The aluminum layer 52 may be deposited using a depositionmethod, such as physical vapor deposition (PVD), chemical vapordeposition (CVD) or atomic layer deposition. (ALD). Examples of PVDsuitable for forming the aluminum layer 52 include plating,electroplating, electroless plating, sputtering and combinationsthereof. Examples of sputtering apparatus that may be suitable fordepositing the aluminum layer 52 include DC diode type systems, radiofrequency (RF) sputtering, magnetron sputtering and ionized metal plasma(IMP) sputtering.

Still referring to FIGS. 2A and 2B, a metal fill 32 is formed on thematerial stack of the titanium layer 51 and the aluminum layer 52 in atleast the first and second via openings 28, 29. The metal fill 32provides the metal fill of the final first device contact 30 that isdepicted in FIG. 1. The metal fill 32 is typically composed of tungsten(W). For example, the metal fill 32 may be composed substantiallyentirely of tungsten. For example, the metal fill 32 may be greater than95 wt. % tungsten (W). In other embodiments, the metal fill 32 may beequal to 99 wt. % tungsten (W) or greater, e.g., the metal fill 32 canbe 100 wt. % tungsten. Other metals that may be used for the metal fill32 can include copper (Cu), gold (Au), silver (Ag), nickel (Ni) andalloys thereof, as well as alloys with tungsten (W). The metal fill 32may be formed in direct contact with the aluminum layer 52. The metalfill 32 may be deposited to a thickness that at least fills the firstand second via openings 28, 29. In some embodiments, the metal fill 32may be a single material layer that is present in each of the first andsecond via openings 28, 29 and extends across the upper surfaces of theinterlevel dielectric 16 between the adjacent first and second viaopenings 28, 29 to each of the first and second semiconductor devices 50a, 50 b in a continuous fashion. The metal fill 32 may be depositedusing a deposition method, such as physical vapor deposition (PVD),chemical vapor deposition (CVD) or atomic layer deposition (ALD). In oneembodiment, the metal fill 32 is composed of tungsten that is depositedusing chemical vapor deposition (CVD), in which the metal fill 32 has aheight atop the first and second via openings 28, 29 of approximately200 nm. Variations of CVD processes suitable for forming the metal fill32 include, but are not limited to, Atmospheric Pressure CVD (APCVD),Low Pressure CVD (LPCVD) and Plasma Enhanced CVD (PECVD), Metal-OrganicCVD (MOCVD) and combinations thereof may also be employed.

Following deposition, the metal fill 32 may be planarized. For example,the metal fill 32 may be planarized using chemical mechanicalplanarization (CMP). In one embodiment, following planarization, theheight of the metal fill 32, e.g., tungsten (W) metal fill 32, asmeasured from the upper surface of the first and second via openings 28may be 50 nm or less.

FIG. 3A depicts forming a block mask 53 over the first contact via 28that is depicted in FIG. 2A. The block mask 53 may comprise soft and/orhardmask materials and can be formed using deposition, photolithographyand etching. In one embodiment, the block mask comprises an organicplanarization layer (OPL). The organic planarization layer (OPL) may bea photo-sensitive organic polymer comprising a light-sensitive materialthat, when exposed to electromagnetic (EM) radiation, is chemicallyaltered and thus configured to be removed using a developing solvent.For example, the photo-sensitive organic polymer may be polyacrylateresin, epoxy resin, phenol resin, polyamide resin, polyimide resin,unsaturated polyester resin, polyphenylenether resin,polyphenylenesulfide resin, or benzocyclobutene (BCB). The organicplanarization layer (OPL) may be referred to as a photoresist layer, anda block mask 53 composed of a photoresist material may be referred to asa photoresist block mask. A photoresist block mask can be produced byapplying a photoresist layer, exposing the photoresist layer to apattern of radiation, and then developing the pattern into thephotoresist layer utilizing conventional resist developer. Typically,the block masks 53 have a thickness ranging from 100 nm to 300 nm. Theblock mask 53 is formed overlying the first via opening 28 protectingthe portion of the metal fill 32, aluminum layer 52, and titanium layer51 present therein, wherein the portion of the metal fill 32, aluminumlayer 52, and titanium layer 51 that is not present in the first viaopening 28 may not be covered by the block mask 53, and is thereforeexposed.

FIG. 3B depicts removing the portion of the metal fill 32, e.g.,tungsten (W) fill, that is present in the second via opening 29, whilethe block mask 53 is present over the first via opening 28 depicted inFIG. 3A. In some embodiments, the portion of the metal fill 32 that ispresent in the second via opening 29 is removed by an etch that isselective to the block mask 53 and the aluminum layer 52. The term“selective” as used in reference to a material removal process denotesthat the rate of material removal for a first material is greater thanthe rate of removal for at least another material of the structure towhich the material removal process is being applied. For example, in oneembodiment, a selective etch may include an etch chemistry that removesa first material selectively to a second material by a ratio of 100:1 orgreater, e.g., 1000:1. The etch process for forming the portion of themetal fill 32 that is present in the second via opening 29 may be ananisotropic etch process. As used herein, an “anisotropic etch process”denotes a material removal process in which the etch rate in thedirection normal to the surface to be etched is greater than in thedirection parallel to the surface to be etched. The anisotropic etch mayinclude reactive-ion etching (RIE). For example, when the metal fill 32is composed of tungsten, one reactive etch chemistry used with RIE thatcan remove the metal fill 32 selectively to the aluminum layer 52 andthe block mask 53 may be an SF₆ based chemistry. Other examples ofanisotropic etching that can be used at this point of the presentdisclosure include ion beam etching, plasma etching or laser ablation.The etch process may also be timed and/or employ end point detectionmethods to determine when the etch process has reached and exposed asurface of the aluminum layer 51.

In another example, the metal fill 32 may be removed by a wet etch thatremoves the metal fill 32 selectively to the block mask 53 and thealuminum layer 52. In one embodiment, in which the metal fill 32 iscomposed of tungsten (W), the wet etch chemistry for removing thetungsten metal fill 32 may be NH₄OH:H₂O₂:H₂O in a ratio of 1:1.5:50 thatis applied at a temperature ranging from 20° C. to 25° C.

FIG. 4B further depicts converting the aluminum layer 52 within thesecond via opening 29 to an oxide containing metal 54, e.g., aluminumoxide (Al₂O₃). Converting the aluminum layer 52 to a metal oxide layer54, e.g., aluminum oxide, allows for the metal oxide layer 54 to beremoved by an etch process that is selective to the underlying titaniumlayer 51. In some embodiments, the conversion of the aluminum layer intothe first dielectric metal-containing compound portion 32A can beperformed by plasma oxidation, in which an oxygen-containing plasmaoxidizes the aluminum layer into a metal oxide material. The plasmaoxidation can employ a plasma of oxygen or ozone within a pressure rangefrom 0.1 mTorr to 10 mTorr, although lesser and greater pressures canalso be employed. In other embodiments, the aluminum layer may beconverted into an aluminum oxide layer 54 by thermal oxidation. Thermaloxidation may include annealing in an oxygen containing atmosphere. Inone embodiment, the oxygen-containing atmosphere may include one or moreoxygen containing gases, such as molecular oxygen (O₂), ozone (O₃),water vapor (H₂O), an nitrogen-oxides (NO, NO₂, etc.), among otheroxygen-containing gases. The oxygen-containing atmosphere may alsoinclude radical oxygen and hydroxyl species such as atomic oxygen (O),hydroxides (OH), etc., that may be generated remotely and transportedinto the substrate chamber. Ions of oxygen-containing species may alsobe present. During the conversion process, the thermal annealing processtemperature may range from about 25° C. to about 1100° C. (e.g., about200° C., about 300° C., about 400° C., about 500° C., about 600° C.,about 700° C., about 800° C., about 900° C., about 1000° C., etc.).

Following etching to remove the metal fill 32 from the second viaopening 29, and conversion of the aluminum layer 51 to a metal oxide 54,the block mask 35 may be removed using selective etching, chemicalstripping or oxygen ashing, as depicted in FIGS. 4A and 4B.

FIG. 5A and 5B depict removing the metal oxide layer 54, e.g., aluminumoxide layer, from the second via opening 29 with an etch that isselective to the titanium layer 51 that is present in the second viaopening 29. The etch process for removing the metal oxide layer 54,e.g., aluminum oxide layer, may be selective to the titanium layer 51 inthe second via opening 29, as well as the remaining portion of the metalfill 32, e.g., tungsten (W) metal fill, that is present atop the firstvia opening 28. In some embodiments, the etch process for removing themetal oxide layer 54 may be an isotropic etch, which is a substantiallynon-directional etch. For example, the etch process for removing themetal oxide layer 54 may be provided by a wet chemical etch. In oneembodiment, in which the metal oxide layer 54 is composed of aluminumoxide (Al₂O₃) layer selectively to the titanium layer 51 may be a wetetch comprising NH₄OH: H₂O at a ratio ranging from 1:10 to 1:300 at atemperature ranging from 25° C. to 65° C. In another embodiment, the wetetch for removing the aluminum oxide layer, i.e., the metal oxide layer54, selectively to the titanium layer 51 may includetera-methyl-ammonium hydroxide (C₄H₁₃NO), which can be diluted TMAH. Itis noted that the titanium layer 51 remains within the second viaopening 29 on the sidewalls of the second via opening 29 and the base ofthe second via opening 29 at this stage of the process sequence. Thepresence to the titanium layer 51 within the second via opening 29minimizes trench widening, i.e., increasing the width of the second viaopening 29.

FIG. 6A and 6B depict one embodiment of treating the structure depictedin FIGS. 5A and 5B with a thermal anneal. FIG. 6A depict the alloying ofthe aluminum (Al) from the aluminum layer 52 and the titanium (Ti) fromthe titanium layer 51 with silicon from the silicon and germaniumincluding source and rain regions 20 a, 20 b, 25 a, 25 b in the firstvia opening 28. The alloying results from thermal diffusion that occursduring treatment of the structures depicted in FIGS. 6A and 6B with thethermal anneal. The alloying of the aluminum (Al) from the aluminumlayer 52 and the titanium (Ti) from the titanium layer 51 with siliconfrom the silicon and germanium including source and rain regions 20 a,20 b, 25 a, 25 b produces the metal liner 31 of an aluminum, titaniumand silicon alloy at a base of the first device contact 20 that isdescribed above with reference to FIG. 1. Therefore, further detailsregarding the alloying of the aluminum (Al) from the aluminum layer 52and the titanium (Ti) from the titanium layer 51 with silicon from thesilicon and germanium including source and rain regions 20 a, 20 b, 25a, 25 b to provide the metal liner 31, such as the composition of themetal liner 31, are provided above in the description of FIG. 1.

FIG. 6B depicts converting the titanium layer 51 that is present in thesecond via opening 29 to a titanium oxide layer 34 with a thermal annealincluding an oxidizing atmosphere, which may also be referred to as athermal oxidation anneal. The application of the thermal oxidationanneal to the titanium layer 51 in the second via opening 29 may providethe thermal annealing to alloy of the aluminum (Al) from the aluminumlayer 52 and the titanium (Ti) from the titanium layer 51 with siliconfrom the silicon and germanium including source and rain regions 20 a,20 b, 25 a, 25 b to produce the metal liner 31 at a base of the firstdevice contact 20. Further details regarding the titanium oxide layer 34depicted in FIG. 6B are provided above by the description of thetitanium oxide layer 34 that is depicted in FIG. 1.

In one embodiment, the thermal anneal used to form the metal liner 31 inthe first via opening 28 and the titanium oxide layer 34 in the secondvia opening 29 may include an oxygen-containing atmosphere. In someexamples, the oxygen containing atmosphere of the thermal anneal mayinclude one or more oxygen containing gases, such as molecular oxygen(O₂), ozone (O₃), water vapor (H₂O), an nitrogen-oxides (NO, NO₂, etc.),among other oxygen-containing gases. The oxygen-containing atmospheremay also include radical oxygen and hydroxyl species such as atomicoxygen (O), hydroxides (OH), etc., that may be generated remotely andtransported into the substrate chamber. Ions of oxygen-containingspecies may also be present. The temperature of the thermal annealingprocess used to form the metal liner 31 in the first via opening 28 andthe titanium oxide layer 34 in the second via opening 29 may range fromabout 25° C. to about 1100° C. (e.g., about 200° C., about 300° C.,about 400° C., about 500° C., about 600° C., about 700° C., about 800°C., about 900° C., about 1000° C., etc.).

FIGS. 7A and 7B depicting the first contact via, while a metal layer 36is being deposited in the second via opening 29 directly on the titaniumoxide layer 34. In some embodiments, the metal layer 36 comprisestitanium (Ti). For example, the metal layer 36 may be composed ofgreater than 95 wt. % titanium (Ti). In other embodiments, the metallayer 36 may be equal to 99 wt. % titanium (Ti) or greater, e.g., themetal layer 36 can be 100 wt. % titanium. The metal layer 36 may be acontinuous layer that is formed on the sidewalls and base of the secondvia opening 29. For example, the metal layer 36 may be formed directlyon the titanium oxide layer 34 that is present on the surface of thesource and drain regions 25 a, 25 b of the second semiconductor device50 b. The metal layer 36 may also be formed directly on the titaniumoxide layer 34 that is present on the sidewalls of the second viaopening 29. The metal layer 36 may be a blanket deposited layer.Therefore, a portion of the metal layer 36 may be present atop theremaining portion of the metal fill 32 that is present in the first viaopening 28. The metal layer 36 may be a conformally deposited layerhaving a thickness ranging from 1 nm to 10 nm. In some embodiments, themetal layer 36 has a thickness ranging from 2 nm to 5 nm. In oneexample, the metal layer 36 has a thickness of 3 nm. The metal layer 36may be deposited using a deposition method, such as physical vapordeposition (PVD), chemical vapor deposition (CVD) or atomic layerdeposition. (ALD). Examples of PVD suitable for forming the metal layer36 include plating, electroplating, electroless plating, sputtering andcombinations thereof. Examples of sputtering apparatus that may besuitable for depositing the metal layer 36 include DC diode typesystems, radio frequency (RF) sputtering, magnetron sputtering andionized metal plasma (IMP) sputtering.

FIGS. 8A and 8B depict depositing a metal fill 33 atop the structuresdepicted in FIGS. 7A and 7B. The metal fill 33 may be deposited to fillthe second via openings 29. The metal fill 33 provides the metal fill 33of the final second device contact 35 that is depicted in FIG. 1. Themetal fill 33 is typically composed of tungsten (W). For example, themetal fill 33 may be composed substantially entirely of tungsten. Forexample, the metal fill 33 may be greater than 95 wt. % tungsten (W). Inother embodiments, the metal fill 33 may be equal to 99 wt. % tungsten(W) or greater, e.g., the metal fill 33 can be 100 wt. % tungsten. Othermetals that may be used for the metal fill 33 can include copper (Cu),gold (Au), silver (Ag), nickel (Ni) and alloys thereof, as well asalloys with tungsten (W). The metal fill 33 may be formed in directcontact with the metal layer 36 that is present in the second viaopening 29. The metal fill 33 may be deposited to a thickness that atleast fills the second via opening 29. In some embodiments, the metalfill 33 may be a single material layer that fills the second via opening29 and extends across over the upper surfaces of the interleveldielectric 16 between the adjacent first and second via openings 28, 29to also cover, i.e., overly, the first via opening 28, in which themetal fill 33 is in direct contact with the metal layer 36. The metalfill 33 may be deposited using a deposition method, such as physicalvapor deposition (PVD), chemical vapor deposition (CVD) or atomic layerdeposition (ALD). Variations of CVD processes suitable for forming themetal fill 33 include, but are not limited to, Atmospheric Pressure CVD(APCVD), Low Pressure CVD (LPCVD) and Plasma Enhanced CVD (PECVD),Metal-Organic CVD (MOCVD) and combinations thereof may also be employed.

Following deposition, the metal fill 33 may be planarized. For example,the metal fill 32 may be planarized using chemical mechanicalplanarization (CMP). In one embodiment, the planarization processcontinues until an upper surface of the interlevel dielectric 16 isexposed. The planarization process may remove the portions of the metalfill 33 and the metal liner 36 that are overlying the first via opening28 to provide the first device contact 30 and the second device contact35 that are depicted in FIG. 1.

The methods and structures that have been described above with referenceto FIGS. 1-7 may be employed in any electrical device includingintegrated circuit chips. The integrated circuit chips including thedisclosed structures and formed using the disclosed methods may beintegrated with other chips, discrete circuit elements, and/or othersignal processing devices as part of either (a) an intermediate product,such as a motherboard, or (b) an end product. The end product can be anyproduct that includes integrated circuit chips, including computerproducts or devices having a display, a keyboard or other input device,and a central processor.

While the methods and structures of the present disclosure have beenparticularly shown and described with respect to preferred embodimentsthereof, it will be understood by those skilled in the art that theforegoing and other changes in forms and details may be made withoutdeparting from the spirit and scope of the present disclosure. It istherefore intended that the present disclosure not be limited to theexact forms and details described and illustrated, but fall within thescope of the appended claims.

What is claimed is:
 1. A method of forming contacts to an electricaldevice comprising: providing a first via to a first semiconductor devicecomprising at least one of a silicon and germanium containing source anddrain region and providing a second via to a second semiconductor devicecomprising at least one of a silicon containing source and drain region;forming a material stack in the first and second via, the first materialstack comprising a first metal layer and a second metal layer;converting the second metal layer of the first material stack within thesecond via to a second metal oxide; removing the second metal oxide withan etch that is selective to the first metal layer; converting the firstmetal layer present in the second via to first metal oxide with anoxidation anneal, wherein during said oxidation anneal the second metallayer in the first via alloys with the first metal layer and siliconfrom the silicon and germanium containing source and drain region toprovide a binary metal semiconductor alloy; depositing a cap metal layerin the second via; and depositing a metal fill in one at least one ofthe first and second via.
 2. The method of claim 1 further comprisingforming a first tungsten layer filling the first and second via afterforming the material stack.
 3. The method of claim 2 further comprisingforming a block mask over the first via, and removing the first tungstenlayer from the second via.
 4. The method of claim 3, wherein removingthe first tungsten layer from the second via comprises an etch that isselective to the second metal layer that is present in the second via,wherein the etch comprises reactive ion etch with a SF₆ based chemistryor a wet etch comprising NH₄OH:H₂O₂:H₂O in a ratio of 1:1.5:50 at 20° C.to 25° C. .
 5. The method of claim 1, wherein the converting of thesecond metal layer of the first material stack within the second via tothe second metal oxide comprises an oxygen plasma treatment.
 6. Themethod of claim 1, wherein said removing the second metal oxide withsaid etch that is selective to the titanium layer comprises a wet etchcomprising NH₄OH:H₂O at a ratio ranging from 1:10 to 1:300 at atemperature ranging from 25° C. to 65° C., or a wet etch of dilutedTMAH.
 7. The method of claim 1, wherein depositing the cap metal layerin the second via comprises deposition of titanium using chemical vapordeposition, physical vapor deposition, atomic layer deposition or acombination thereof.
 8. The method of claim 3, said depositing the metalfill comprises depositing tungsten directly atop the metal layer in thesecond via and tungsten atop the first tungsten layer in the first via,and planarizing the tungsten fill.
 9. A method of forming contacts to anelectrical device comprising: providing a first via to a firstsemiconductor device comprising at least one of a silicon and germaniumcontaining source and drain region, and a second via to a secondsemiconductor device comprising at least one of a silicon containingsource and drain region; forming a material stack in the first andsecond via, the first material stack comprising a first metal layer at abase of said first and second via, a second metallayer on the firstmetal layer, and a tungsten fill; removing the tungsten fill and thesecond metal layer from the second via; converting the first metal layerpresent in the second via to a first metal oxide with an oxidationanneal, wherein during said oxidation anneal the second metal layer inthe first via alloys with the first metal layer and silicon from thesilicon and germanium containing source and drain region to provide abinary metal semiconductor alloy; depositing a titanium layer in thesecond via; and depositing tungsten in the second via.
 10. The method ofclaim 9, wherein said removing the tungsten fill and the second metallayer from the second via comprises: forming a block mask over the firstvia; removing the tungsten fill from the second via; converting thesecond metal layer within the second via to a second metal oxide; andremoving the second metal oxide with an etch that is selective to thetitanium layer.
 11. The method of claim 10, wherein removing thetungsten fill from the second via comprises an etch that is selective tothe second metal layer that is present in the second via, wherein theetch comprises reactive ion etch with a SF₆ based chemistry or a wetetch comprising NH₄OH:H₂O₂:H₂O in a ratio of 1:1.5:50 at 20° C. to 25°C.
 12. The method of claim 10, wherein the converting of the secondmetal layer within the second via to the second metal oxide comprises anoxygen plasma treatment.
 13. The method of claim 10, wherein saidremoving the second metal oxide with said etch that is selective to thefirst metal layer comprises a wet etch comprising NH₄OH:H₂O at a ratioranging from 1:10 to 1:300 at a temperature ranging from 25° C. to 65°C., or a wet etch of diluted TMAH.
 14. The method of claim 9, whereindepositing a first metal layer in the second via comprises chemicalvapor deposition, physical vapor deposition, atomic layer deposition ora combination thereof.
 15. The method of claim 9, said depositing thetungsten in the second via comprises depositing tungsten directly atopthe first metal layer in the second via and tungsten atop the firsttungsten layer in the first via, and planarizing the tungsten fill. 16.An electrical device comprising: a first semiconductor device present ina first region of a substrate, the first semiconductor device includingat least one of a silicon and germanium containing source and drainregion; a second semiconductor device in a second region of thesubstrate, the second semiconductor device including at least one of asilicon containing source and drain region; a first device contact to atleast one of said silicon and germanium containing source and drainregion of the first semiconductor device, the first device contactincluding a metal liner of an binary metal and silicon alloy at a baseof the first device contact and a first tungsten fill; and a seconddevice contact to at least one of the silicon containing source anddrain region of the second semiconductor device, the second devicecontact comprising a material stack of a titanium oxide layer at thebase of the second device contact and a titanium layer atop the titaniumoxide layer, wherein the second device contact may further include asecond tungsten fill.
 17. The electrical device of claim 16, wherein thesilicon and germanium containing source and drain region of the firstsemiconductor device comprise a p-type conductivity.
 18. The electricaldevice of claim 17, wherein the binary metal and silicon alloy at thebase of the first device contact forms a silicide with a surface of thesilicon and germanium containing source and drain region of the firstsemiconductor device.
 19. The electrical device of claim 17, wherein thesilicon containing source and drain region of the second semiconductordevice comprises an n-type dopant.
 20. The electrical device of claim19, wherein at least one of the p-type dopant and the n-type dopant ispresent in a concentration ranging from 1×10¹⁹ dopants/cm³ to 1×10²¹dopants/cm³.